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HiSilicon Technologies Shares Best Practices to Accelerate Tapeout of their 7-nm, Arm Cortex-A76 based High-Performance Mobile AI Computing Chipset - Sponsored By Synopsys, Inc.

  • Yangle Wu, HiSilicon Technologies,
  • Ron Duncan, Synopsys, Inc.

HiSilicon will describe select methodologies and best practices they used to design their mobile AI computing chipset that is deployed in Huawei's flagship smartphones. In this session, you will learn how HiSilicon overcame the challenges in designing a large, complex, highly integrated SoC on TSMC’s 7-nm node with Arm’s latest CPU, Cortex A-76. Their approach leverages Synopsys Fusion Technology for a highly convergent RTL-to-Signoff flow, including physical signoff, that enabled HiSilicon to achieve best PPA and reduce time to tapeout using a massively parallel physical signoff architecture.

  • Date:Wednesday, October 17
  • Time:11:30 AM - 12:20 PM
  • Location:Executive Ballroom 210D
  • Session Type:Sponsored Session
  • Room:Executive Ballroom 210D
  • Pass Type:All-Access Pass, Expo Floor Pass
Speakers
Yangle Wu
HiSilicon Technologies
Ron Duncan
Synopsys, Inc.